High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ

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EMS PCB Assembly [40]
Turnkey PCB Assembly [15]
PCB Assembly Services [10]
Printed Circuit Board Assembly [10]
SMT PCB Assembly [10]
Through Hole PCB Assembly [10]
LED PCB Assembly [30]
Prototype PCB Assembly [10]
Flexible Printed Circuit Boards [10]
Rigid Flex PCB [10]
Aluminium PCB Board [10]
COB Assembly [10]
Double Sided PCB Board [9]
Multilayer PCB [10]

Shenzhen Jingxin Electronic Technology Co., Ltd.

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High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ

Contact Now

High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ

Detailed Product Description Material: FR4 Board Thickness: 1.2mm Copper Thickness: 1OZ Feature 1: Gerber/PCB File Needed Feature 2: 100% E-test Feature 3: 2 Years Guarantee High Density Interconnect ...

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pcb printed circuit board assembly

pcb manufacturing and assembly

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